半導體微感測器設計與測試
CMOS-MEMS Sensor Design, Testing and Evaluation
Spring, 2016
Class Schedule: Wednesday, 2:20pm-5:20pm at Room 107, 應力館
Instructor: 黃榮山 (Long-Sun Huang),
應力館Room 419 (02-3366-5653)
Office Hour: appointment by email (Prof. Huang)
References:
1. M. Madou, Foundamentals of Microfabrication, 1997 (CRC Press).
2. G.T.A. Kovacs, Micromachined Transducer Sourcebook, 1998S. D. Senturia, Microsystem Design, 2001 (Kluwer Academic publishers)
3. 莊達人, VLSI 製造技術, 1995 (高立圖書有限公司)
4. S.M. Sze, VLSI Technology, 2nd ed., 1988 (McGraw Hill).
Course Description:
The integration of MEMS technology with the mainstream CMOS technology is referred to as CMOS-MEMS technology. The use of CMOS-MEMS technique has been increasingly accepted in foundry semiconductor industry to create miniaturized sensors, actuators, and structures such as accelerometers, microphone, gyro sensor, electronic compass, and micro resonators. Thanks to this enabling technique and unique advantages offered by foundry semiconductor incorporations in Taiwan, the CMOS-MEMS sensors (microcantilever sensor, etc.) can be realized in class to allow students for hands-on operation, packaging, parameter testing, and device functional evaluation. This course is interdisciplinary nature of micromachining techniques and their applications. In addition to the micro science and sensor-oriented engineering lecture, the course will also provide lab project for simplified hands-on experiments to gain practical sense of foundry CMOS-MEMS micro sensors.
核心能力關聯
博士班
1. 力學與相關領域之專業知識與技術，以及運用數學、科學及工程知之能力。
2. 獨立思考、創新、設計工程系統、元件及製程之能力。
3. 策劃及執行專題研究、撰寫技術報告及論文之能力。
4. 設計與執行工程實務、進行實驗以及分析與解釋數據之能力

碩士班
1. 力學與相關領域之專業知識與技術，以及運用數學、科學及工程知識之能力。
2. 獨立思考、創新、設計工程系統、元件及製程之能力。
3. 策劃及執行專題研究、撰寫技術報告及論文之能力。
4. 設計與執行工程實務、進行實驗以及分析與解釋數據之能力。
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Course Outline
Date Topics Lab Lab
Assignment
(1) Fabrication Lecture
Wk 1 Introduction, Schedule, Policies, documents (NDA form, CIC registration, etc)
Wk 2 CMOS-MEMS processes
(TSMC 2P4M